Thermal Clad & Metal Backed PCB's
Epec offers Thermal Clad PCB’s which is a dielectric metal base with a bonded copper circuit layer. This creates superior heat transfer to help cool components while eliminating problems associated with managing fragile ceramics. Thermal clad is a unique layered system comprised of the follow layers:
Circuit Layer: Printed circuit foil with thickness of 1oz to 5 oz.
Dielectric Layer: Many different options which offer electrical isolation with minimum thermal resistance. Also used to bond the circuit layer and base material together. Each specific dielectric has its own UL recognition.
Base Layer: Most often Aluminum, but can also be copper. The most commonly used thickness is 0.040" (1.0mm) although many thicknesses are available.
Thermal Clad PCB’s – Applications
Power Conversion: Thermal clad offers a variety of thermal performances is compatible with mechanical fasteners and is highly reliable.
LED’s: Using Thermal Clad PCB’s assures the lowest possible operating temperatures and maximum brightness, color and life.
Motor Drives: Thermal Clad dielectric choices provide the electrical isolation needed to meet operating parameters and safety agency test requirements.
Solid State Relays: Thermal clad offers a very thermally efficient and mechanically robust substrate.
Automotive: The automotive industry uses Thermal clad boards as they need long term reliability under high operating temperatures coupled with their requirement of effective space utilization.
Improve the durability and performance of your product by using Thermal Clad PCB’s. Simple designs and low thermal impedance of the dielectric out performs all other PCB insulators for power and high-operating temperature components.
- Material
- Bergquist
- Thermagon
- Arlon
- Denka
- Specifications
- 1 & 2 Layer Dielectrics
- Up to 5 oz finished Cu
- Al and CU base material up to .250" thick
- HASL, ENIG and Pb Free HASL finish available
- Benifits
- Lower Operating Temperatures
- Improved Product Durability
- Increased Power Density
- Increased Thermal Efficiency
- Reduced Number of Interconnects
- Lower Junction Temperatures
- Reduced PCB Size
- Eliminates Older Hardware
- Minimizes Labor Required for Assembly
- Wide Variety of Form Factors
- Minimize Thermal Impedance